Product
Standard |
Alloy
Symbol |
Chemical Composition & Impurities Allowance (%) |
Reference |
Sn |
Pb |
Sb |
Cu |
Bi |
Zn |
Fe |
Al |
As |
Cd |
S.T(℃) |
L.T(℃) |
Specific Gravity |
RS60 |
60±1 |
Bal. |
0.12 ~ 0.50 |
0.05 Max |
0.10 Max |
0.002 Max |
0.02 Max |
0.002 Max |
0.03 Max |
0.002 Max |
Approx 183 |
Approx 190 |
Approx 8.5 |
Flux Characteristics |
Items |
AA |
A |
B |
Dryness |
Powder of choke must be easily removed from any test piece. |
Chlorine Content |
0.1 Min |
0.1 ~ 0.5 |
0.5 ~ 1.0 |
Corrosion |
Copper Plate Corrosion |
Corrosion level of test piece must not be big compare with counter test piece. |
Copper Mirror or Copper Plating Plate Corrosion |
Corrosion of test piece must not be big compared with standard flux. |
- |
- |
Aqueous Solution Resistance (Ωm) |
1000 Min |
500 Min |
- |
Insulation Resistance (Ω) |
1 × 1012 Min |
1 × 1011 Min |
1 × 108 Min |
Voltage permissible tolerance to moisture |
Ω |
1 × 1012 Min |
1 × 1011 Min |
1 × 108 Min |
Naked Eye |
Obvious corrosion must not exist on every part of test piece. |
The Spreading Rate (%) |
75 Min |
80 Min |
80 Min |
Solder |
Do A Grade of Soft Solder |
Measurement and Tolerance (mm) |
0.8 ~ 5.0 |
± 0.1 |
0.7 Max |
± 0.05 |
Mechanical properties |
Zinc Solder (SHC) |
Soldering lead wire onto zinc sprayed surface of film capacitor. Good dispersion and adherence. |
Packing |
Bobbin |
0.5 1 5 Kg |
According to customer's request. |
